A NEW EQUIVALENT CIRCUIT SCHEME FOR GROUNDED BACK-TO-BACK GCPW-MS-GCPW TRANSITIONS FABRICATED ON A THIN LOW-K SUBSTRATE

We hereby present a new equivalent circuit model including both lumped and distributed elements for GCPW-MS transitions (GCPW Grounded CoplanarWaveguide MS Microstrip). In order to validate the modelling results, such have been fabricated on 20 μm-thick BCB (Benzocyclobutene resin) substrate using grounding pads via-holes of different diameters. The study focused impact via-hole diameter performance transition more specifically its bandwidth. were made simple technological process based photosensitive polymer. ADS simulation data in very good agreement with measured S-parameters. Both theoretical experimental results shown that bandwidth can reach up 100 GHz 900 μm diameter.